Cinterion a global leader in cellular machine-to-machine (M2M) communication modules and a Gemalto (Euronext NL 0000400653 GTO) company today announced AGS2 the world’s smallest surface mount automotive M2M module providing global voice and data communications for vehicle telematics. The new module is Cinterion’s first offering as an Associate Partner in the Intel® Intelligent Systems Alliance program which provides original equipment manufacturers (OEMs) and developers with the advanced hardware software firmware tools and systems integration support needed to bring leading-edge technology solutions to market faster. 

Cinterion’s tiny AGS2 Land Grid Array (LGA) surface mount module was designed for cost effective vehicle telematics such as fleet management solutions car alarms and eCall applications. The module features a secure Internet protocol connection best-in-class digital audio and advanced voice technology with voice prompts which can be crucial during emergencies. Quad-band capability helps eliminate coverage disruptions providing reliable communications even when roaming between counties and across different carrier networks. The module’s advanced jamming detection feature strengthens theft prevention while its low power consumption helps extend vehicle battery life. AGS2’s rugged design extended temperature range and superior shielding together enable reliability in the most extreme automotive conditions of heat cold vibration and moisture.

“Our new AGS2 module was developed in close collaboration with Intel to take advantage of their latest chipset and to ensure our product roadmaps are in sync” said Norbert Muhrer CEO Cinterion. “By combining Cinterion’s M2M expertise with early access to Intel’s most advanced platforms we are able to quickly launch first-to-market modules that give our customers a competitive advantage in their next generation solutions.”

“Cinterion’s high quality products and leadership in the growing M2M sector makes them an ideal collaborator in the Intel Intelligent Systems Alliance one of the world’s most recognised and trusted technology ecosystems” said Rick Lisa Group Sales Director WW M2M Business Development Intel Embedded Sales Group. “Together we can offer cutting-edge technology that helps developers innovate M2M solutions to simplify and optimise enterprise and industrial operations.”

AGS2 development kits are available immediately with commercial production starting now.

For more information about the Intel Intelligent Systems Alliance program click here.

Source: Cinterion

Link to original Article

http://www.ertico.com/cinterion-introduces-world-s-smallest-surface-mount-automotive-module-as-part-of-the-intel-intelligent-systems-alliance-program/

Original Publication Date: Fri 15 Jun 2012